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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13876185
Filing Dt:
03/27/2013
Publication #:
Pub Dt:
07/18/2013
Inventors:
Yasuhiro Okafuji, Takuma Onda, Hiroshi Kuwagaki
Title:
Cu-Co-Si-BASED ALLOY FOR ELECTRONIC MATERIAL AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
030093/0150Recorded: 03/27/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/08/2013
Exec Dt:
03/08/2013
Exec Dt:
03/08/2013
Assignee:
6-3, OTEMACHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN 1008164
Correspondent:
DRINKER BIDDLE & REATH ATTN: INTELLECTUA
ONE LOGAN SQUARE, SUITE 2000
PHILADELPHIA, PA 19103-6996

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