Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/16/2014
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Application #:
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13877224
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Filing Dt:
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04/01/2013
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Publication #:
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Pub Dt:
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07/18/2013
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Inventors:
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Tomohiro Uno, Takashi Yamada, Atsuo Ikeda
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Title:
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BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 1010021 |
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| 158-1 OAZA SAYAMAGAHARA, IRUMA-SHI |
| SAITAMA, JAPAN 3580032 |
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| LOUIS J. DELJUIDICE |
| TROUTMAN SANDERS LLP |
| 405 LEXINGTON AVENUE, CHRYSLER BUILDING |
| NEW YORK, NY 10174-0700 |
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Assignment:
2
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MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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Newly Merged Entity's New Name:
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 101-0021 |
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| TROUTMAN SANDERS LLP |
| 875 THRID AVENUE |
| NEW YORK, NY 10022 |
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Assignment:
3
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| 13-1, NIHONBASHI 1-CHOME, CHUO-KU |
| TOKYO, JAPAN 103-0027 |
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| TROUTMAN SANDERS LLP |
| 875 THIRD AVENUE |
| NEW YORK, NY 10022 |
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