Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13717431
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Filing Dt:
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12/17/2012
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Publication #:
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Pub Dt:
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07/25/2013
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Inventor:
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Sheng YI
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Title:
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MULTI-LAYER PRINTED CIRCUIT BOARD (PCB)
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5 FLOOR, ZHONGGUANCUN FOUNDER BUILDING |
| NO. 298 CHENGFU ROAD, HAIDIAN DISTRICT |
| BEIJING, CHINA 100871 |
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| FOUNDER PCB INDUSTRY PARK |
| XIYONG MICROELECTRONIC INDUSTRIAL PARK, SHAPINBA |
| CHONGQING, CHINA 401332 |
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| FOUNDER PCB INDUSTRY PARK, FUSHAN INDUSTRY ZONE |
| QIANWU, DOUMEN DISTRICT |
| ZHUHAI CITY, GUANGDONG, CHINA 519175 |
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| FINNEGAN, HENDERSON, FARABOW, GARRETT & |
| 901 NEW YORK AVENUE, NW |
| WASHINGTON, DC 20001-4413 |
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