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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/10/2014
Application #:
13723531
Filing Dt:
12/21/2012
Publication #:
Pub Dt:
07/25/2013
Inventor:
Jens Ejury
Title:
MULTI-LAYER INTEGRATED CIRCUIT PACKAGE
Assignment: 1
Reel/Frame:
031747/0407Recorded: 12/10/2013Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/23/2013
Assignee:
640 N. MCCARTHY BLVD.
MILPITAS, CALIFORNIA 95035
Correspondent:
MURPHY, BILAK & HOMILLER, PLLC
8000 REGENCY PARKWAY, SUITE 415
CARY, NC 27518
Assignment: 2
Reel/Frame:
031942/0026Recorded: 01/10/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/10/2014
Assignee:
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER, PLLC
8000 REGENCY PARKWAY, SUITE 415
CARY, NC 27518

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