Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/30/2017
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Application #:
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13485307
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Filing Dt:
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05/31/2012
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Publication #:
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Pub Dt:
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08/15/2013
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Inventors:
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Chih-Hao Chen, Hsien-Wen Liu, Yi-Lin Tsai, Jui-Pin Hung, Jing-Cheng Lin
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Title:
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Methods for Molding Integrated Circuits
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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