Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/09/2016
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Application #:
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13383555
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Filing Dt:
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05/03/2013
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Publication #:
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Pub Dt:
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08/15/2013
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Inventors:
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Pan Shen, Xinchun Lu, Yongyong He
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Title:
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METHOD FOR MEASURING THICKNESS OF FILM ON WAFER EDGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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QINGHUAYUAN |
HAIDIAN DISTRICT |
BEIJING, CHINA 100084 |
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BING AI |
PERKINS COIE LLP |
PO BOX 1247 |
SEATTLE, WA 98111-1247 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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#8 BUILDING, NO. 9 JUXING RD., HAIHE SCI-TECH PARK |
JINNAN DISTRICT |
TIANJIN, CHINA 300350 |
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BING AI |
PERKINS COIE LLP |
PO BOX 1247 |
SEATTLE, WA 98111-1247 |
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