Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/30/2014
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Application #:
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13858639
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Filing Dt:
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04/08/2013
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Publication #:
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Pub Dt:
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08/29/2013
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Inventors:
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Chii-Ping CHEN, Chih-Hao CHEN
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Title:
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INTEGRATED CIRCUITS INCLUDING AIR GAPS AROUND INTERCONNECT STRUCTURES, AND FABRICATION METHODS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 30 |
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| LOWE HAUPTMAN HAM & BERNER, LLP (TSMC) |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 251 LITTLE FALLS DRIVE |
| WILMINGTON, DELAWARE 19808 |
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| MICHAEL MCCARTNEY |
| 1891 ROBERTSON RD. SUITE 100 |
| OTTAWA, K2H5B7 CANADA |
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