Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/05/2017
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Application #:
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13883154
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Filing Dt:
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05/02/2013
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Publication #:
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Pub Dt:
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08/29/2013
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Inventors:
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Andreas Steffen Klein, Frank Krüger, Eckhard Ditzel, Michael Schumann
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Title:
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CHIP-INTEGRATED THROUGH-PLATING OF MULTI-LAYER SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HERAEUSSTRASSE 12-14 |
| HANAU, GERMANY 63450 |
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| LEIBNITZSTRASSE 4 |
| REGENSBURG, GERMANY 93055 |
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| SHERYL NEUMANN (920-113US) |
| PANITCH SCHWARZE BELISARIO & NADEL LLP |
| 2005 MARKET STREET, SUITE 2200 |
| PHILADELPHIA, PA 19103-7013 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LEIBNITZSTRASSE 4 |
| REGENSBURG, GERMANY 93055 |
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| ELIZABETH SEGGERN |
| 2005 MARKET STREET |
| SUITE 2200 |
| PHILADELPHIA, PA 19103 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNOR NAME PREVIOUSLY RECORDED ON REEL 031628 FRAME 0597. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| LEIBNIZSTRASSE 4 |
| REGENSBURG, GERMANY 93055 |
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| PANITCH SCHWARZE BELISARIO & NADEL |
| 2005 MARKET STREET |
| SUITE 2200 |
| PHILADELPHIA, PA 19103 |
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05/29/2024 12:55 PM
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