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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/09/2015
Application #:
13404819
Filing Dt:
02/24/2012
Publication #:
Pub Dt:
08/29/2013
Inventors:
I-Ming Chang, Wen-Huei Guo, Chih-Hao Chang, Shou-Zen Chang, Clement Hsingjen Wann et al
Title:
CURVED WAFER PROCESSING ON METHOD AND APPARATUS
Assignment: 1
Reel/Frame:
027767/0351Recorded: 02/27/2012Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/21/2012
Exec Dt:
02/22/2012
Exec Dt:
02/22/2012
Exec Dt:
02/23/2012
Exec Dt:
02/23/2012
Exec Dt:
02/21/2012
Exec Dt:
02/22/2012
Exec Dt:
02/21/2012
Assignee:
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
SLATER & MATSIL, L.L.P.
17950 PRESTON RD., SUITE 1000
DALLAS, TX 75252

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