Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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07/28/2015
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Application #:
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13886888
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Filing Dt:
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05/03/2013
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Publication #:
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Pub Dt:
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09/19/2013
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Inventors:
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Somchai Nondhasitthichai, Saravuth Sirinorakul
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Title:
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MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 237 LASALLE ROAD |
| BANGNA, BANGKOK, THAILAND 10260 |
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| THOMAS B. HAVERSTOCK |
| 162 N WOLFE ROAD |
| SUNNYVALE, CA 94086 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO ADD THE ANNEX A AND THE ANNEX B WHICH WAS INADVERTENTLY LEFTOUT IN THE ORIGINAL ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED ON REEL 037959 FRAME 0937. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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