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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/12/2015
Application #:
13641093
Filing Dt:
10/12/2012
Publication #:
Pub Dt:
10/03/2013
Inventors:
Hiroshi Ishii, Hideo Sugaya, Yasuhiro Asai
Title:
Stress and Strain Sensing Device
Assignment: 1
Reel/Frame:
029124/0382Recorded: 10/12/2012Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/01/2012
Exec Dt:
10/01/2012
Exec Dt:
10/01/2012
Assignees:
SARUGAKU-CHO 1-5-18
CHIYODA-KU
TOKYO, JAPAN 1010064
NISHISHINAGAWA 2-2-40
SHINAGAWA-KU
TOKYO, JAPAN 1410033
Correspondent:
GAVIN MILCZAREK-DESAI/QUARLES & BRADY
ONE SOUTH CHURCH AVENUE, SUITE 1700
TUCSON, AZ 85701-1621
Assignment: 2
Reel/Frame:
060884/0969Recorded: 08/24/2022Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/04/2022
Assignee:
HIROMACHI 1-5-28-104, SHINAGAWA-KU
TOKYO, JAPAN 1400005
Correspondent:
QUARLES & BRADY LLP (IP DOCKET TUC)
ONE SOUTH CHURCH AVENUE
SUITE 1800
TUCSON, AZ 85701

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