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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/20/2016
Application #:
13994668
Filing Dt:
06/14/2013
Publication #:
Pub Dt:
10/03/2013
PCT #:
US1158429
Inventors:
Mark T. Bohr, Christopher M. Pelto, Seshu V. Sattiraju, Kevin J. Lee, Andrew W. Yeoh et al
Title:
3D INTERCONNECT STRUCTURE COMPRISING FINE PITCH SINGLE DAMASCENE BACKSIDE METAL REDISTRIBUTION LINES COMBINED WITH THROUGH-SILICON VIAS
Assignment: 1
Reel/Frame:
027151/0186Recorded: 10/31/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/30/2011
Exec Dt:
09/30/2011
Exec Dt:
09/30/2011
Exec Dt:
09/30/2011
Exec Dt:
09/30/2011
Exec Dt:
09/30/2011
Exec Dt:
09/30/2011
Assignee:
2200 MISSION BOULEVARD
SANTA CLARA, CALIFORNIA 95052
Correspondent:
BLAKELY SOKOLOFF TAYLOR & ZAFMAN
1279 OAKMEAD PARKWAY
SUNNYVALE, CA 94085-4040

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