Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13704581
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Filing Dt:
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05/30/2013
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Publication #:
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Pub Dt:
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10/10/2013
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Inventors:
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Isao Nakatani, Masato Hirose, Satoru Kurita, Tatsuya Kiyota, Keita Harashima
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Title:
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METAL NANOPARTICLE PASTE, ELECTRONIC COMPONENT ASSEMBLY USING METAL NANOPARTICLE PASTE, LED MODULE, AND METHOD FOR FORMING CIRCUIT FOR PRINTED WIRING BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2-1, SENGEN |
| TSUKUBA-SHI |
| IBARAKI, JAPAN 305-0047 |
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| WOODCOCK WASHBURN LLP |
| 2929 ARCH STREET |
| CIRA CENTRE, 12TH FLOOR |
| PHILADELPHIA, PA 19104-2891 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-19-43, HIGASHI-OIZUMI |
| NERIMA-KU |
| TOKYO, JAPAN 178-8511 |
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| WOODCOCK WASHBURN LLP |
| 2929 ARCH STREET |
| CIRA CENTRE, 12TH FLOOR |
| PHILADELPHIA, PA 19104-2891 |
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