Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13912406
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Filing Dt:
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06/07/2013
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Publication #:
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Pub Dt:
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10/17/2013
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Inventors:
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Kengo Kaminaga, Keisuke Yamanishi, Ryo Fukuchi
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Title:
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Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit Using Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-3, OTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8164 |
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| WILLIAM BAK, HOWSON & HOWSON LLP |
| 501 OFFICE CENTER DRIVE |
| SUITE 210 |
| FORT WASHINGTON, PA 19034 |
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