Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
|
Application #:
|
13550067
|
Filing Dt:
|
07/16/2012
|
|
Publication #:
|
|
Pub Dt:
|
10/17/2013
| | | | |
|
Inventors:
|
Kwang Soo KIM, Bum Seok SUH, Young Ki LEE, Kee Ju UM, Suk Ho LEE, Young Hoon KWAK
|
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING HEAT DISSIPATION, SEMICONDUCTOR MODULE, AND MOUNTING STRUCTURE THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 314 MAETAN 3-DONG, YEONGTONG-GU, SUWON |
| GYUNGGI-DO, KOREA, REPUBLIC OF |
|
|
|
|
| MCDERMOTT WILL & EMERY LLP |
| 600 13TH STREET, N.W. |
| WASHINGTON, DC 20005-3096 |
|
|
Search Results as of:
05/12/2024 01:30 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
