Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13783901
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Filing Dt:
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03/04/2013
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Publication #:
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Pub Dt:
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10/24/2013
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Inventors:
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Lijuan Zhong, Joseph Michael Stephan, The Ngoc Nguyen, Carl Kristian Lunde
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Title:
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SOLDERABLE PAD FABRICATION FOR MICROELECTRONIC COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10200 SOUTH DEANZA BOULEVARD |
| CUPERTINO, CALIFORNIA 95014 |
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| HOLZERIPLAW, PC |
| 216 16TH STREET, SUITE 1350 |
| DENVER, CO 80202 |
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