Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/09/2016
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Application #:
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13868963
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Filing Dt:
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04/23/2013
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Publication #:
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Pub Dt:
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10/24/2013
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Inventor:
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Brian D. Flinn
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Title:
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BOND PLY FOR ADHESIVE BONDING OF COMPOSITES AND ASSOCIATED SYSTEMS AND METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4311 11TH AVENUE N.E. |
| SUITE 500 |
| SEATTLE, WASHINGTON 98105-4608 |
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| AARON J. POLEDNA |
| PERKINS COIE LLP |
| P.O. BOX 1247 |
| SEATTLE, WA 98111-1247 |
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