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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
9000071
Issue Dt:
04/07/2015
Application #:
13872682
Filing Dt:
04/29/2013
Publication #:
20130284502
Pub Dt:
10/31/2013
Inventors:
Jae Man PARK, SungBae MOON, SungJin YUN, Hyuk Soo LEE, In Hee CHO, Hae Yeon KIM et al
Title:
EPOXY RESIN, EPOXY RESIN COMPOUND COMPRISING THE SAME, AND RADIANT HEAT CIRCUIT BOARD USING THE COMPOUND
Assignment: 1
Reel/Frame:
030365/0259Recorded: 05/07/2013Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PARK, JAE MAN
Exec Dt:
04/24/2013
KIM, HAE YEON
Exec Dt:
04/24/2013
MOON, SUNGBAE
Exec Dt:
04/24/2013
PARK, JEUNGOOK
Exec Dt:
04/24/2013
YUN, SUNGJIN
Exec Dt:
04/24/2013
YOON, JONGHEUM
Exec Dt:
04/24/2013
LEE, HYUK SOO
Exec Dt:
04/24/2013
JEONG, JAEHUN
Exec Dt:
04/24/2013
CHO, IN HEE
Exec Dt:
04/24/2013
Assignee:
LG INNOTEK CO., LTD.
SEOUL SQUARE, 416
NAMDAEMUNNO 5-GA, JUNG-GU
SEOUL, KOREA, REPUBLIC OF 100-714
Correspondent:
JEFF LLOYD
PO BOX 142950
GAINESVILLE, FL 32614-2950

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