Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13772208
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Filing Dt:
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02/20/2013
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Publication #:
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Pub Dt:
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10/31/2013
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Inventors:
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Takashi SUZUKI, Kouichi SAITOU, Yasuyuki YANASE
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Title:
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METAL BONDING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-5, KEIHAN-HONDORI 2-CHOME |
| MORIGUCHI-SHI, OSAKA, JAPAN 570-8677 |
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| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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