Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13880186
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Filing Dt:
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04/18/2013
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Publication #:
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Pub Dt:
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10/31/2013
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Inventors:
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Masahiro Wada, Ken Ukawa, Kenji Yoshida, Yusuke Tanaka
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Title:
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RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 140-0002 |
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| BIRCH, STEWART, KOLASCH, & BIRCH, LLP. |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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