Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/26/2015
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Application #:
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13849248
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Filing Dt:
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03/22/2013
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Publication #:
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Pub Dt:
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11/14/2013
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Inventors:
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Yoshiyuki Yoneda, Ryuji Nomoto, Koichi Nakamura
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Title:
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ENCAPSULATED SEMICONDUCTOR CHIPS WITH WIRING INCLUDING CONTROLLING CHIP AND METHOD OF MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-10-23, SHIN-YOKOHAMA, KOHOKU-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 222-0033 |
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| WESTERMAN, HATTORI, DANIELS & ADRIAN, LL |
| 1250 CONNECTICUT AVE, NW |
| SUITE 700 |
| WASHINGTON, DC 20036 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-10-23 SHIN-YOKOHAMA, KOHOKU-KU |
| YOKOHAMA-SHI, KANAGAWA, JAPAN 222-0033 |
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| WESTERMAN, HATTORI, DANIELS AND ADRIAN |
| 1250 CONNECTICUT AVENUE, NW |
| SUITE 700 |
| WASHINGTON, DC 20036 |
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