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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13883252
Filing Dt:
07/26/2013
Publication #:
Pub Dt:
11/14/2013
Inventor:
Yoshiki Hirai
Title:
MIXED POWDER HIGH-DENSITY MOLDING METHOD AND MIXED POWDER HIGH-DENSITY MOLDING SYSTEM
Assignment: 1
Reel/Frame:
030890/0560Recorded: 07/28/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/24/2013
Assignee:
2-10, OHYAMA-CHO, MIDORI-KU
SAGAMIHARA-SHI, KANAGAWA, JAPAN 252-5181
Correspondent:
MCDERMOTT WILL & EMORY
500 NORTH CAPITOL STREET NW
WASHINGTON, DC 20001

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