Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/10/2016
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Application #:
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13868622
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Filing Dt:
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04/23/2013
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Publication #:
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Pub Dt:
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11/14/2013
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Inventors:
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Masahito TANABE, Michihiro SUGO, Shohei TAGAMI, Hiroyuki YASUDA, Hideto KATO
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Title:
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TEMPORARY ADHESIVE FOR WAFER PROCESSING, MEMBER FOR WAFER PROCESSING USING THE SAME, WAFER PROCESSED BODY, AND METHOD FOR PRODUCING THIN WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-1, OHTEMACHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| WILLIAM P. BERRIDGE |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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