Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13976629
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Filing Dt:
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07/17/2013
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Publication #:
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Pub Dt:
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11/14/2013
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Inventors:
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Hiroshi Yamauchi, Hiroyuki Morita, Hiroshi Natsui
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Title:
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RESIN COMPOSITION FOR EXPANSION MOLDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-4, NISHITEMMA 2-CHOME |
| KITA-KU, OSAKA-SHI |
| OSAKA, JAPAN 5300047 |
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| CLAUDIA SIU ORELLANA |
| 1030 15TH ST. N.W. |
| SUITE 400 EAST |
| WASHINGTON, DC 20005 |
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