Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/03/2015
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Application #:
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13475526
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Filing Dt:
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05/18/2012
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Publication #:
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Pub Dt:
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11/21/2013
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Inventors:
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Daniel C. Edelstein, Takeshi Nogami, Christopher Parks, Tsong-Lin Tai
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Title:
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COPPER INTERCONNECT STRUCTURE AND ITS FORMATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| INTERNATIONAL BUSINESS MACHINES CORPORAT |
| BLDG. 321-482 |
| 2070 ROUTE 52 |
| HOPEWELL JUNCTION, NY 12533 |
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