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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/07/2015
Application #:
13982875
Filing Dt:
07/31/2013
Publication #:
Pub Dt:
11/21/2013
Inventors:
Kenichi Takahashi, Tetsuya Kawamura, Akira Ueda, Atsushi Fujii
Title:
Sealing Material for Thin Plate Member
Assignment: 1
Reel/Frame:
030914/0680Recorded: 07/31/2013Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/11/2013
Exec Dt:
07/11/2013
Exec Dt:
07/11/2013
Exec Dt:
07/11/2013
Assignee:
1-1, OSAKI 2-CHOME, SHINAGAWA-KU
TOKYO, JAPAN 1416024
Correspondent:
THE WEBB LAW FIRM, P.C.
ONE GATEWAY CENTER
420 FT. DUQUESNE BLVD, SUITE 1200
PITTSBURGH, PA 15222
Assignment: 2
Reel/Frame:
048390/0311Recorded: 02/21/2019Pages: 17
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/01/2018
Assignee:
1-1 OSAKI 2-CHOME SHINAGAWA-KU
TOKYO, JAPAN 141-6024
Correspondent:
CPA GLOBAL LIMITED
LIBERATION HOUSE
CASTLE STREET
ST HELIER, JE1 1BL JERSEY

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