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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/17/2015
Application #:
13957690
Filing Dt:
08/02/2013
Publication #:
Pub Dt:
11/28/2013
Inventor:
Toshio HANADA
Title:
SEMICONDUCTOR POWER MODULE AND METHOD OF MANUFACTURING THE SAME
Assignment: 1
Reel/Frame:
030931/0556Recorded: 08/02/2013Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/23/2013
Assignee:
21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI,
KYOTO, JAPAN 615-8585
Correspondent:
RABIN & BERDO, PC
1101 14TH STREET, NW
SUITE 500
WASHINGTON, DC 20005

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