Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13480341
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Filing Dt:
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05/24/2012
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Publication #:
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Pub Dt:
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11/28/2013
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Inventors:
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Sony Varghese, Andrew Carswell, Kozaburo Sakai, Andrey V. Zagrebelny, Wayne Huang, Jin Lu et al
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Title:
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Substrates Comprising Integrated Circuitry, Methods Of Processing A Substrate Comprising Integrated Circuitry, And Methods Of Back-Side Thinning A Substrate Comprising Integrated Circuitry
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MS 1-525 |
| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83716 |
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| MARK S. MATKIN |
| WELLS ST. JOHN, P.S. |
| 601 W. 1ST AVE., #1300 |
| SPOKANE, WA 99201 |
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