Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/04/2014
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Application #:
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13480458
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Filing Dt:
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05/24/2012
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Publication #:
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Pub Dt:
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11/28/2013
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Inventors:
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Daniel W. Jarvis, Richard Hung Minh Dinh
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Title:
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THIN MULTI-LAYERED STRUCTURES PROVIDING RIGIDITY AND CONDUCTIVITY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 INFINITE LOOP |
| CUPERTINO, CALIFORNIA 95014 |
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| TI LAW GROUP |
| 2055 JUNCTION AVE., SUITE 205 |
| SAN JOSE, CA 95131 |
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