Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13707485
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Filing Dt:
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12/06/2012
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Publication #:
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Pub Dt:
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11/28/2013
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Inventor:
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Jun ZHOU
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Title:
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METHOD WHICH CAN FORM CONTACT HOLES IN WAFER OF SEMICONDUCTOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 497 GAO SI ROAD |
| ZHANGJIANG HI-TECH PARK, PUDONG |
| SHANGHAI, CHINA |
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| BERGMAN & SONG LLP |
| P.O. BOX 400198 |
| CAMBRIDGE, MA 02140 |
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