Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/03/2018
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Application #:
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13905821
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Filing Dt:
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05/30/2013
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Publication #:
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Pub Dt:
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12/12/2013
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Inventors:
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Tadashi Sawamura, Takeo Igarashi, Yukio Maeda, Kazuhiko Kaneko
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Title:
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Solder paste for bonding micro components
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ALMIT BLDG. 14-2, YAYOICHO 2-CHOME, NAKANO-KU |
TOKYO, JAPAN 164-0013 |
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MCHALE & SLAVIN, P.A. |
2855 PGA BLVD |
PALM BEACH GARDENS, FL 33410 |
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05/07/2024 04:35 AM
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