Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
02/25/2014
|
Application #:
|
13494499
|
Filing Dt:
|
06/12/2012
|
|
Publication #:
|
|
Pub Dt:
|
12/12/2013
| | | | |
|
Inventors:
|
Ming LI, Dewen TIAN, Madhukumar JANARDHANAN PILLAI
|
|
Title:
|
BOND PAD ASSESSMENT FOR WIRE BONDING
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
|
|
|
|
| OSTROLENK FABER LLP |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036-8403 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
|
|
|
|
| CPA GLOBAL |
| CASTLE STREET , LIBERATION HOUSE |
| ST HELIER, JERSEY, JE1 1BL JERSEY |
|
|
Search Results as of:
05/22/2024 12:19 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
