Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13542782
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Filing Dt:
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07/06/2012
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Publication #:
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Pub Dt:
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12/12/2013
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Inventors:
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Keng-Hung Lin, Ming-Lun Chang, Yu-Min Lin
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Title:
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Pre-molded Cavity 3D Packaging Module with Layout
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2F, NO. 42, PARK AVENUE 2, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| NO.8, ALLEY 48, LANE 240, KUOSHENG ST., CHUPEI CITY |
| HSINCHU COUNTY, TAIWAN |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 8230 BOONE BLVD. SUITE 405 |
| VIENNA, VA 22182 |
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