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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13494692
Filing Dt:
06/12/2012
Publication #:
Pub Dt:
12/12/2013
Inventors:
Fei Yu, Qi Deng
Title:
TSV SUBSTRATE WITH MIRROR AND ITS APPLICATION IN HIGH-SPEED OPTOELECTRONIC PACKAGING
Assignment: 1
Reel/Frame:
028405/0324Recorded: 06/19/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/31/2012
Exec Dt:
05/31/2012
Assignee:
5340 LEGACY DRIVE
SUITE 175
PLANO, TEXAS 75024
Correspondent:
SHUN YAO
PARK, VAUGHAN, FLEMING & DOWLER LLP
2820 FIFTH STREET
DAVIS, CA 95618

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