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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	9555466	Issue Dt:	01/31/2017	Application #:	14002297	Filing Dt:	08/29/2013
Publication #:	20130340239	Pub Dt:	12/26/2013
Inventors:	Hiroyuki Hasegawa, Masahito Ueda, Kinya Watanable, Naoya Fujii
Title:	SUBSTRATE JOINING METHOD USING RIVET, AND JOINING STRUCTURE

Assignment: 1

Reel/Frame:

031123/0727

Recorded: 08/29/2013

Pages: 2

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

UEDA, MASAHITO

Exec Dt:

08/26/2013

HASEGAWA, HIROYUKI

Exec Dt:

08/19/2013

WATANABE, KINYA

Exec Dt:

08/19/2013

FUJI, NAOYA

Exec Dt:

08/19/2013

Assignee:

NIHON UNIVERSITY

8-24, KUDAN-MINAMI 4-CHOME

CHIYODA-KU, TOKYO, JAPAN 102-8275

Correspondent:

JORDAN AND HAMBURG LLP

122 EAST 42ND STREET

SUITE 4000

NEW YORK, NY 10168

Assignment: 2

Reel/Frame:

031247/0176

Recorded: 09/20/2013

Pages: 4

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE LISTED 4TH ASSIGNOR FROM NAOYA FUJI TO NAOYA FUJII PREVIOUSLY RECORDED ON REEL 031123 FRAME 0727. ASSIGNOR(S) HEREBY CONFIRMS THE NAME OF THE LISTED 4TH ASSIGNOR, SHOULD BE CORRECTED TO NAOYA FUJII.

Assignors:

UEDA, MASAHITO

Exec Dt:

08/26/2013