Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/19/2014
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Application #:
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14034440
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Filing Dt:
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09/23/2013
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Publication #:
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Pub Dt:
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01/23/2014
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Inventors:
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Jin-Yuan Lee, Mou-Shiung Lin
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Title:
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CHIP PACKAGES HAVING DUAL DMOS DEVICES WITH POWER MANAGEMENT INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F.-1, NO. 9, PUDING ROAD, EAST DISTRICT |
| HSIN-CHU, TAIWAN 30072 |
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| SEYFARTH SHAW LLP |
| 2029 CENTURY PARK EAST, SUITE 3500 |
| LOS ANGELES, CA 90067-3021 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121-1714 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121-1714 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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