Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/01/2019
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Application #:
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13982686
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Filing Dt:
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10/17/2013
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Publication #:
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Pub Dt:
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02/06/2014
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Inventors:
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Akira Yamauchi, Tadatomo Suga, Ryuichi Kondou, Yoshiie Matsumoto
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Title:
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BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE BONDING METHOD, BONDING-SUBSTRATE FABRICATION APPARATUS, AND SUBSTRATE ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-25, NISHINOHATA OKUBO-CHO, UJI-SHI |
| KYOTO, JAPAN |
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| 16-20, UENO 6-CHOME, TAITO-KU |
| TOKYO, JAPAN |
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| 38-2, YOYOGI 1-CHOME, SHIBUYA-KU |
| TOKYO, JAPAN |
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| 6-3, HIGASHINAKANO 3-CHOME, NAKANO-KU |
| TOKYO, JAPAN |
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| PEARNE & GORDON LLP |
| 1801 E 9TH ST. |
| SUITE 1200 |
| CLEVELAND, OH 44135 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 38-2, YOYOGI 1-CHOME |
| SHIBUYA-KU |
| TOKYO, JAPAN 151-0053 |
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| 6-3, HIGASHINAKANO 3-CHOME |
| NAKANO-KU |
| TOKYO, JAPAN 164-0003 |
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| PEARNE & GORDON LLP |
| 1801 EAST 9TH STREET |
| SUITE 1200 |
| CLEVELAND, OH 44114 |
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