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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/05/2016
Application #:
14003335
Filing Dt:
10/30/2013
Publication #:
Pub Dt:
02/13/2014
Inventor:
Takashi Iseki
Title:
Pb-FREE SOLDER PASTE
Assignment: 1
Reel/Frame:
031595/0075Recorded: 11/13/2013Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/22/2013
Assignee:
11-3, SHIMBASHI 5-CHOME, MINATO-KU,
TOKYO, JAPAN 105-8716
Correspondent:
KRATZ, QUINTOS & HANSON, LLP
4TH FLOOR
1420 K STREET, N.W.
WASHINGTON, DC 20005

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