Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/12/2014
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Application #:
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14057045
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Filing Dt:
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10/18/2013
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Publication #:
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Pub Dt:
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02/13/2014
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Inventors:
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Tsung-Fu TSAI, Yian-Liang KUO, Chih-Horng CHANG
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Title:
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SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| LOWE HAUPTMAN & HAM, LLP (TSMC) |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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