Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13960694
|
Filing Dt:
|
08/06/2013
|
|
Publication #:
|
|
Pub Dt:
|
02/13/2014
| | | | |
|
Inventors:
|
Yusaku Shimizu, Takeshi Matsumura, Eiji Toyoda, Tsuyoshi Torinari
|
|
Title:
|
RESIN SHEET FOR SEALING ELECTRONIC COMPONENT, RESIN-SEALED TYPE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING RESIN-SEALED TYPE SEMICONDUCTOR DEVICE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1-1-2, SHIMOHOZUMI |
| IBARAKI-SHI, OSAKA, JAPAN 567-8680 |
|
|
|
|
| ALLEMAN HALL MCCOY RUSSELL & TUTTLE LLP |
| 806 SW BROADWAY |
| SUITE 600 |
| PORTLAND, OR 97205-3335 |
|
|
Search Results as of:
05/02/2024 01:13 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
