Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/30/2014
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Application #:
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13951596
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Filing Dt:
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07/26/2013
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Publication #:
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Pub Dt:
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02/27/2014
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Inventors:
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Eiji HASHINO, Shinji ISHIKAWA, Shinichi TERASHIMA, Masamoto TANAKA
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Title:
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LEAD-FREE SOLDER BUMP BONDING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 101-0021 |
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| KENYON & KENYON LLP |
| ONE BROADWAY |
| NEW YORK, NY 10004 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 16-3,GINZA 7-CHOME, CHUO-KU, |
| TOKYO, JAPAN |
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| HUNTON ANDREWS KURTH LLP |
| 2200 PENNSYLVANIA AVE |
| SUITE 900 |
| WASHINGTON, DC 20037 |
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