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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
09/09/2014
Application #:
13603377
Filing Dt:
09/04/2012
Publication #:
Pub Dt:
03/06/2014
Inventors:
Kaushik Rajashekara, Ruxi Wang, Zheng Chen, Dushan Boroyevich
Title:
MULTILAYER PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING
Assignment: 1
Reel/Frame:
033994/0156Recorded: 10/21/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/07/2014
Exec Dt:
07/03/2014
Exec Dt:
07/03/2014
Assignee:
301 BURRUSS HALL
BLACKSBURG, VIRGINIA 24061
Correspondent:
VIRGINIA TECH INTELLECTUAL PROPERTIES
2200 KRAFT DRIVE, SUITE 1050
BLACKSBURG, VA 24060
Assignment: 2
Reel/Frame:
033363/0581Recorded: 07/22/2014Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/21/2014
Assignee:
2001 S. TIBBS AVENUE
MAIL DROP U27
INDIANAPOLIS, INDIANA 46241
Correspondent:
JASON A. HOUDEK
KIREG DEVAULT, LLP
ONE INDIANA SQUARE, SUITE 2800
INDIANAPOLIS, IN 46204
Assignment: 3
Reel/Frame:
033994/0202Recorded: 10/21/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/12/2014
Assignee:
2200 KRAFT DRIVE, SUITE 1050
BLACKSBURG, VIRGINIA 24060
Correspondent:
VIRGINIA TECH INTELLECTUAL PROPERTIES
2200 KRAFT DRIVE, SUITE 1050
BLACKSBURG, VA 24060

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