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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
13961180
Filing Dt:
08/07/2013
Publication #:
Pub Dt:
03/06/2014
Inventors:
Wei Zhang, Xiaoliang Chu
Title:
Module Assembling Device
Assignment: 1
Reel/Frame:
030960/0918Recorded: 08/07/2013Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/30/2013
Exec Dt:
07/30/2013
Assignees:
NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT
BEIJING, CHINA 100015
NO. 118 JINGHAIYILU, BDA
BEIJING, CHINA 100176
Correspondent:
SILLS CUMMIS & GROSS P.C.
30 ROCKEFELLER PLAZA
NEW YORK, NY 10112

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