Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/27/2015
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Application #:
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14010245
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Filing Dt:
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08/26/2013
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Publication #:
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Pub Dt:
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03/13/2014
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Inventors:
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Masahiro Kyozuka, Akihiko Tateiwa, Jun Furuichi, Yuji Kunimoto
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 80, OSHIMADA-MACHI |
| NAGANO-SHI |
| NAGANO-KEN, JAPAN 381-2287 |
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| RANDY J. PRITZKER |
| 600 ATLANTIC AVENUE |
| WOLF GREENFIELD & SACKS, P.C. |
| BOSTON, MA 02210 |
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