Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/10/2015
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Application #:
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14083521
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Filing Dt:
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11/19/2013
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Publication #:
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Pub Dt:
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03/13/2014
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Inventors:
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Yi-Jen LAI, Chih-Kang HAN, Chien-Pin CHAN, Chih-Yuan CHIEN, Huai-Tei YANG
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Title:
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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-77 |
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| LOWE HAUPTMAN & HAM, LLP (TSMC) |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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