Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14016212
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Filing Dt:
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09/02/2013
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Publication #:
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Pub Dt:
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03/20/2014
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Inventors:
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Chang-Yuan Wu, Tse-An Chu, Jia-Yu Hung, Ching-Ya Tu
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Title:
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MULTI-LAYER FLAT HEAT DISSIPATING STRUCTURE FOR ELECTRONIC DEVICE CASING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.581, RUIGUANG RD., NEIHU DISTRICT, |
| TAIPEI CITY, TAIWAN 11492 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
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