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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
11/14/2017
Application #:
14001486
Filing Dt:
12/03/2013
Publication #:
Pub Dt:
03/20/2014
Inventors:
Matthias Hutter, Hermann Oppermann, Christian Ehrhardt
Title:
PASTE FOR JOINING COMPONENTS OF ELECTRONIC MODULES, SYSTEM AND METHOD FOR APPLYING THE PASTE
Assignment: 1
Reel/Frame:
031535/0836Recorded: 11/04/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/17/2013
Exec Dt:
09/18/2013
Exec Dt:
09/18/2013
Assignee:
HANSASTR. 27C
MÜNCHEN, GERMANY 80686
Correspondent:
STUDEBAKER & BRACKETT PC
12700 SUNRISE VALLEY DRIVE
SUITE 102
RESTON, VA 20191
Assignment: 2
Reel/Frame:
032020/0761Recorded: 11/19/2013Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS PREVIOUSLY RECORDED ON REEL 031535 FRAME 0836. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
09/17/2013
Exec Dt:
09/18/2013
Exec Dt:
09/18/2013
Assignee:
HANSASTR. 27C
MUENCHEN, GERMANY 80686
Correspondent:
STUDEBAKER & BRACKETT PC
12700 SUNRISE VALLEY DRIVE
SUITE 102
RESTON, VA 20191

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