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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/10/2015
Application #:
13635024
Filing Dt:
09/14/2012
Publication #:
Pub Dt:
03/27/2014
Inventors:
Hiroki Yoshioka, Naoki Kohda
Title:
ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT PACKAGE MANUFACTURING METHOD
Assignment: 1
Reel/Frame:
028973/0347Recorded: 09/14/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/13/2012
Exec Dt:
09/13/2012
Assignee:
1389, AZA-KONO, SHINZAIKE, HIRAOKA-CHO,
KAKOGAWA-SHI, HYOGO, JAPAN 675-0194
Correspondent:
MOTS LAW, PLLC
1629 K STREET N.W.
SUITE 200
WASHINGTON, DC 20006-1635

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