Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/10/2015
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Application #:
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14114862
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Filing Dt:
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11/15/2013
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Publication #:
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Pub Dt:
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03/27/2014
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Inventors:
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Hiroyuki Mori, Kazunari Maki
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Title:
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COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY THIN PLATE FOR ELECTRONIC/ELECTRIC DEVICE, METHOD OF PRODUCING COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRONIC/ELECTRIC DEVICE AND TERMINAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-2, OTEMACHI 1-CHOME, CHIYODA-KU, |
| TOKYO, JAPAN 1008117 |
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| 4-7-35, KITASHINAGAWA, SHINAGAWA-KU |
| TOKYO, JAPAN 1408550 |
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| MITSUHIRO HARAGUCHI, LEASON ELLIS LLP |
| ONE BARKER AVENUE |
| FIFTH FLOOR |
| WHITE PLAINS, NY 10601-1526 |
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