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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/21/2014
Application #:
13631990
Filing Dt:
09/29/2012
Publication #:
Pub Dt:
04/03/2014
Inventors:
Weng Hong TEH, Vinodhkumar RAGHUNATHAN
Title:
EMBEDDED STRUCTURES FOR PACKAGE-ON-PACKAGE ARCHITECTURE
Assignment: 1
Reel/Frame:
030889/0828Recorded: 07/25/2013Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/12/2012
Exec Dt:
10/29/2012
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANATA CLARA, CALIFORNIA 95054
Correspondent:
KONRAD RAYNES DAVDA & VICTOR LLP
350 S. BEVERLY DR.
SUITE 360
BEVERLY HILLS, CA 90212
Assignment: 2
Reel/Frame:
032745/0557Recorded: 04/23/2014Pages: 6
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE ADDRESS PREVIOUSLY RECORDED ON REEL 030889 FRAME 0828. ASSIGNOR(S) HEREBY CONFIRMS THE RECEIVING PARTY CITY SHOULD BE CORRECTED FROM "SANATA CLARA" TO "SANTA CLARA".
Assignors:
Exec Dt:
10/12/2012
Exec Dt:
10/29/2012
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
KONRAD RAYNES
350 S. BEVERLY DR.
SUITE 360
BEVERLY HILLS, CA 90212

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